ESEC Die Bonder Service Engineer

Job Description
Would you like to become more familiar with the fascinating world of the global semiconductor industry? Dynamism, flexibility, as well as rapid, solution-oriented responses to new needs in the marketplace, are the order of the day in this field. As a mechatronics company, Besi Austria GmbH provides system solutions to the semiconductor industry and is a worldwide leader in shaping the future as it pertains to the field of semiconductor packaging.

For our Customer Support Centre in Austria, we are looking for an: ESEC Die Bonder Service Engineer

Your responsibilities:

• Provide high-level service on Besi equipment in Europe
• Responsible contact person for a new customer project, leading technical and co-ordination tasks
• Supervision & training of Besi customers’ engineers and technicians working on Besi machines
• Improve the equipment performance, MTBA, MTBF, OEE, yield, and throughput. Collect and analyse such data and define improvement programs
• Assist in maintaining existing Besi equipment through advice, troubleshooting, and defining preventive maintenance schedules
• Provide relevant technical information to our customers
• Lead installation of equipment and upgrades
• Inform Besi customers about the latest upgrades on Besi equipment
• Back office administration (buy off materials, machine relocation, spares, etc.).

Your profile:

• Experience in technical support
• Very good knowledge of mechatronic systems
• Willingness to travel to various Besi customers worldwide
• Good knowledge of computer applications for office use
• Strong customer service-oriented attitude
• Experience with Besi Die Bonder equipment will be considered an asset
• Multitasking capability
• Good communication skills
• Strong Team player.

*Interested candidates should send their C.V. and covering letter.

*For further information about our company visit: www.besi.com