ESEC Die Bonder Service Engineer - Engineering jobs in Malta - September 2021

ESEC Die Bonder Service Engineer


Besi Any
JOB TYPE: Full Time JOB LEVEL: Intermediate (1-3 years), Experienced (3 years +)
Would you like to become more familiar with the fascinating world of the global semiconductor industry? Dynamism, flexibility, as well as rapid, solution-oriented responses to new needs in the marketplace, are the order of the day in this field. As a mechatronics company, Besi Austria GmbH provides system solutions to the semiconductor industry and is a worldwide leader in shaping the future as it pertains to the field of semiconductor packaging.

For our Customer Support Centre in Austria, we are looking for an: ESEC Die Bonder Service Engineer

Your responsibilities:
  • Provide high-level service on Besi equipment in Europe
  • Responsible contact person for a new customer project, leading technical and co-ordination tasks
  • Supervision & training of Besi customers’ engineers and technicians working on Besi machines
  • Improve the equipment performance, MTBA, MTBF, OEE, yield, and throughput. Collect and analyse such data and define improvement programs
  • Assist in maintaining existing Besi equipment through advice, troubleshooting, and defining preventive maintenance schedules
  • Provide relevant technical information to our customers
  • Lead installation of equipment and upgrades
  • Inform Besi customers about the latest upgrades on Besi equipment
  • Back office administration (buy off materials, machine relocation, spares, etc.).

Your profile:
  • Experience in technical support
  • Very good knowledge of mechatronic systems
  • Willingness to travel to various Besi customers worldwide
  • Good knowledge of computer applications for office use
  • Strong customer service-oriented attitude
  • Experience with Besi Die Bonder equipment will be considered an asset
  • Multitasking capability
  • Good communication skills
  • Strong Team player.

*Interested candidates should send their C.V. and covering letter.

*For further information about our company visit:

Kindly submit your application directly to us using the 'Apply for Vacancy' button.

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